Applications of Different Particle Sizes of White Fused Alumina Micro Powder
Coarse Powder (for grinding, sandblasting, refractory)
| Particle Size | Particle Range | Typical Applications |
|---|---|---|
| 240# | 63–50 μm | Rough grinding, sandblasting, rust removal, surface cleaning |
| 320# | 50–40 μm | Sandblasting, deburring, general polishing, abrasive stones |
| 400# | 40–28 μm | Fine sandblasting, surface treatment for stainless steel & alloys |
| 600# | 28–20 μm | Precision grinding, refractory materials, grinding tools |
| 800# | 20–14 μm | Fine grinding, deburring, vibratory finishing, auto parts |
Medium Powder (for precision grinding & polishing)
| Particle Size | Particle Range | Typical Applications |
|---|---|---|
| 1000# | 14–10 μm | Precision grinding, mold polishing, tool sharpening |
| 1200# | 10–7 μm | Semi‑finishing polishing, jewelry & 3C parts finishing |
| 1500# | 7–5 μm | High‑precision polishing, ceramic & glass lapping |
| 2000# | 5–3 μm | Ultra‑precision grinding, optical parts processing |
Fine & Superfine Powder (W series, for mirror & CMP polishing)
| W Grade | Particle Range | Typical Applications |
|---|---|---|
| 800# | 20–14 μm | Coarse polishing, grinding paste raw material |
| 1000# | 14–10 μm | Precision grinding, oil stones, tool polishing |
| W10 | 10–7 μm | Pre‑polishing for mirror finish, carbide parts |
| W7 | 7–5 μm | High‑gloss polishing, sapphire & fine ceramics |
| W5 | 5–3 μm | Ultra‑precision polishing, polishing slurries |
| W3.5 | 3.5–2.5 μm | CMP lapping, semiconductor components |
| W2.5 | 2.5–1.5 μm | Mirror polishing, optical lenses, jewelry |
| W1.5 | 1.5–1.0 μm | Nano‑level polishing, sapphire wafers |
| W1.0 | 1.0–0.5 μm | Ultra‑mirror finishing, CMP final polishing |
| W0.5 | <0.5 μm | High‑end optical polishing, ultra‑precision electronics |