White Fused Alumina for Sandblasting Stainless‑Steel Parts of Semiconductor Chip Equipment
White Fused Alumina (abbreviated as WFA), also known as electro‑fused alumina and commonly called emery in the industry, features α‑Al₂O₃ as its main crystal phase with a Mohs hardness of 9. It is a special blasting abrasive for 304/316L stainless‑steel components of semiconductor equipment.
Applicable workpieces: precision stainless‑steel components such as semiconductor vacuum chambers, CF ultra‑high‑vacuum flanges, wafer carrier rings, sealing valve cores, test jigs and gas pipeline assemblies. Functions of sandblasting process: remove burrs, welding spots and oxide scales generated by CNC machining; achieve uniform and controllable matte anchor patterns; serve as surface pretreatment for subsequent grinding, polishing and coating operations.
2. Core Physical & Chemical Indicators of Low‑Sodium High‑Purity White Fused Alumina for Sandblasting Stainless‑Steel Parts of Semiconductor Chip Equipment
- Al₂O₃ ≥ 99.5%
- Fe₂O₃ ≤ 0.05%
- Na₂O ≤ 0.25% (low‑sodium grade to reduce contamination caused by alkali‑metal precipitation)
- SiO₂ ≤ 0.15%
Grain morphology: equant grains with sharp edges, good self‑sharpening performance; new cutting edges are continuously generated as grains fracture during blasting.
3. Blasting Grain Sizes for White Fused Alumina for Sandblasting Stainless‑Steel Parts of Semiconductor Chip Equipment
- Coarse blasting (removal of heavy welding scars and thick oxide scales): F60, F80 / 60#, 80#
- Precision matte blasting (mainstream for semiconductors, yielding fine and uniform matte surfaces): F100, F120, F180, F240 / 100#, 120#, 180#, 240#
Finer grain sizes deliver lower surface Ra values and finer textures, suitable for high‑cleanliness vacuum components.
4. Core Advantages of White Fused Alumina for Sandblasting Stainless‑Steel Parts of Semiconductor Chip Equipment
- Low contamination performance: Ultra-low iron content eliminates iron penetration and surface discoloration after blasting, and prevents heavy metal pollution in semiconductor chip manufacturing environments. The material delivers excellent chemical inertness and acid and alkali resistance, and subsequent ultrasonic cleaning easily removes residual abrasive particles.Controllable surface texture: Sharp angular grains create uniform, stable matte anchor patterns. Users can select matched grain sizes according to target Ra values and avoid over-eroding thin-walled precision stainless steel components.Wear resistance and reusability: High hardness and balanced toughness minimize abrasive consumption. The grit adapts to both dry and wet blasting machines, supports repeated recycling and blasting cycles, and effectively reduces overall production costs.